High-purity organosilicon intermediate methyldiethoxysilane with high purity and low moisture impurities. Its hydrolysis reaction is mild and controllable to form flat films with methyl hydrophobicity, suitable for preparation systems of low-k organosilicon thin films.
Diethoxymethylsilane
CAS # : 2031-62-1
Synonym : DEMS
Technical specs :
Purity, By GC: ≥99.95%; Specification, By ICP-MS: ≥99.9999995%; TMI ≤5ppb
Industry/application :
Precursor for semiconductor low-k layers, moisture-proof insulating coatings for electronic components, hydrophobic coatings for optical glass and synthetic raw material of organosilicon resin for LED packaging, high-end silane modifier for electronic packaging.
Certifications :
ISO,COA,MSDS,TDS